Hotmelt Process

By using the hotmelt process,  sensitive electronic components can be protect from negative environmental influences.

Through different materials, specifications regarding:  flexibility, impact resistance, shock absorption, moisture resistance, tightness, UV protection, chemical resistance and color can be taken into account.

The electronic components are safely protected against corrosion and environmental influences and are also suitable for applications with high humidity or strong temperature fluctuations.

In the low-pressure injection molding process, the components are placed in a mold and coated directly with the hot melt adhesive. The injection pressure is 1.5 – 40 bar, the application temperature range between -50 ° – + 200 ° C. In addition bores and screw threads can be integrated.